On the Frontline of Connectivity:
rugged connectors driving land vehicle performance
Military Vehicle Systems speaks with Tom Larkins, MarCom Manager at LEMO UK, about how rugged interconnect technology underpins today's armoured and tactical vehicle architectures, and why connector performance has become central to modern vetronics and battlefield networking.
Q: How has the increasing digitisation and networking of land vehicles changed the requirements for interconnect systems?
A: The shift toward highly networked land platforms has changed the role of the connector significantly. Modern main battle tanks and infantry fighting vehicles now carry a wide range of digital subsystems—sensors, communications, navigation, mission computers—all of which rely on stable, high-quality data and power links.
Where connectors once carried relatively simple analogue signals, they now must support high-speed digital interfaces, mixed-signal architectures, and stricter EMC requirements. Connectors are effectively part of the data path, so their electrical characteristics matter more than ever.
This is especially important as battlefield awareness becomes a decisive factor in both lethality and survivability. Modern vehicles depend on combining data from multiple sensors instantly, rapid target acquisition, and reliable communications. Next-generation connectors are replacing older military connector formats because they offer improved electrical performance, better shielding, and meaningful space and weight savings—all of which support these operational priorities.
Q: Land vehicles face some of the toughest conditions in defence—how does that impact connector design?
A: Connectors must maintain performance even when the environment is working against them. Land vehicles experience constant vibration, sudden shock loads, and wide temperature swings. Dust, moisture, and water ingress are everyday challenges, especially for vehicles operating in desert or amphibious conditions.
To cope with this, connectors need strong mechanical coupling, stable contact resistance, and reliable sealing. Our M and F Series, for example, are designed to operate over a broad temperature range depending on configuration, and they are sealed to IP68 to prevent dust and water ingress. They also withstand thousands of mating cycles, supporting subsystems that are serviced or reconfigured regularly.
Survivability is more important than ever. Lessons from recent conflicts have shown that armoured vehicles are increasingly vulnerable to aerial threats, particularly UAV-delivered munitions. As a result, crews often operate with hatches down, placing greater reliance on external sighting systems, thermal imagers, and infrared sensors. These systems demand stable, high-integrity interconnects to remain operational under threat.
Q: Different vehicle subsystems have very different requirements. How does LEMO approach this across its product families?
A: We engineer each connector family to address the demands of specific vehicle use cases and environments. The M Series is our most robust solution, designed for the harshest operating conditions and for applications that require high contact density. Its ¾-turn ratchet coupling provides a secure, vibration-resistant connection, and the range supports everything from power and multipole contacts to coaxial and fibre optic configurations, making it particularly well suited to turret and sighting systems, high-bandwidth sensor interfaces, and demanding power distribution roles — all of which are central to modern battlefield performance. The F Series is more compact and features a push-pull mechanism, making it ideal for electronics racks and mission computers where space is tight and quick servicing is important. Then there's the D Series, miniaturised and overmoulded for dense electronics bays and sensor fusion modules. It supports high-speed data formats such as Ethernet and USB, and its design helps maintain signal integrity in electrically noisy environments. Across all families, Size, Weight, and Power (SWaP) optimisation is a key driver. Rapid deployment vehicles need to stay as light as possible so they can be transported efficiently by tactical airlifters or vehicle transporters. Next-generation connectors deliver meaningful space and weight savings compared to older military connector formats, helping vehicle designers meet these constraints without compromising performance.
Q: Standards and interoperability are major concerns for integrators. How do LEMO's solutions align with military requirements?
A: Defence programmes rely on predictable, repeatable performance, so standards compliance is essential. Our connectors are designed to meet many of the performance expectations associated with MIL-DTL-38999, widely regarded as a benchmark for high-reliability circular connectors. They are tested to relevant MIL-STD-810 environmental standards, including vibration, shock, temperature, humidity, and dust.
Where required, we can support alignment with applicable NATO STANAG requirements, helping integrators reduce qualification risk and ensure consistent performance across platforms and mission profiles.
Q: What trends are shaping the next generation of military vehicle interconnects?
A: One of the biggest trends is supporting higher-speed data. As vehicles carry more sensors and onboard processing, data rates increase, and connectors must maintain signal integrity. This is particularly relevant for modern intelligence, surveillance, and reconnaissance (ISR) and targeting systems, where latency and bandwidth directly influence operational effectiveness.
We also see growing interest in hybrid interfaces that combine power, RF, fibre, and digital contacts in a single connector. This reduces harness complexity and weight, supporting SWaP goals for both heavy armour and rapid deployment vehicles.
Modularity is another important trend. Vehicles increasingly use open architectures, so connectors must support rapid upgrades and reconfiguration. Mechanical resilience continues to evolve as vehicles operate in varied and demanding environments, including contested electromagnetic conditions.
Q: Beyond the hardware itself, what kind of system-level support does LEMO provide?
A: We work closely with vehicle OEMs and subsystem integrators to provide complete interconnect solutions. This includes custom cable assemblies, overmoulding for strain relief and environmental protection, and close collaboration with PCB and flex circuit integrators.
Assemblies are tested to the same relevant environmental standards as the connectors themselves, ensuring that the full interconnect system—not just the connector—meets platform performance requirements. This supports long-term reliability and simplifies future upgrades as new sensors, processors, and digital architectures are introduced.
Q: Any final thoughts on the role of rugged interconnects in today's land vehicles?
A: Interconnects have become central to vehicle performance. As platforms become more digital, connected, and reliant on high-speed data, the demands on interconnects increase. Mechanical ruggedness, electrical stability, EMC performance, and lifecycle support all ensure that vehicles remain effective in harsh environments.
Ultimately, the connector is now a critical component of the vehicle architecture. It supports situational awareness, system integration, and mission success, while enabling next-generation technologies.
For more information please visit:
https://lemo.com/en/lemo-circular-connectors
